(China (Mainland))
Product Summary
The W83627HG-AW is a Winbond LPC I/O. It features a whole new interface, namely LPC(Low Pin Count) interface, which will be supported in the next generation Intel chip-set. With this additional freedom, we can implement more devices on a single chip as demonstrated in W83627HG-AW’s integration of Game Port and MIDI Port. It is fully transparent in terms of software which means no BIOS or device driver update is needed except chip-specific configuration. The W83627HG-AW provides two high-speed serial communication ports(UARTs), one of which supports serial Infrared communication
Parametrics
Features
W83627HG-AW absolute maximum ratings: (1)Power Supply Voltage(5V):-0.5 to 7.0V ; (2)Input Voltage:-0.5 to VDD+0.5V ; (3)RTC Battery Voltage VBAT:2.2 to 4.0V ; (4)Operating Temperature:0℃ to +70℃; (5)Storage Temperature:-55℃ to +150℃.
Diagrams
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 W83627HG-AW |
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